- patented trench schottky technology - excellent high temperature stability - low forward voltage - lower power loss/ high efficiency - high forward surge capability molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v dv/dt v/ s v ac v v i f = 5a i f = 10a i f = 5a t j = 125c t j = 25c a t j = 125c ma r jc c/w t j c t stg c document number: ds_d1411033 version: e14 0.48 maximum instantaneous forward voltage per diode (note1) - halogen-free according to iec 61249-2-21 definition 5 maximum average forward rectified current storage temperature range - 55 to +150 voltage rate of change (rated vr) 10000 - 4 100 - 55 to +150 i r taiwan semiconductor features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data 10 trench schottk y rectifier a maximum repetitive peak reverse voltage TSF10U60C per device note 1: pulse test with pulse width=300 s, 1% duty cycle 0.62 2000 0.42 - 150 max. operating junction temperature range - 0.44 TSF10U60C t j = 25c 0.54 parameter min. typ. v - case: ito-220ab mounting torque: 0.56 nm max. weight: 1.7g (approximately) maximum instantaneous reverse current per diode at rated reverse voltage 60 polarity: as marked ito-220ab typical thermal resistance per diode v f 500 60 - - 0.39 - i fsm maximum ratings and electrical characteristics (t a =25c unless otherwise noted) - - per diode i f(av) isolation voltage from terminal to heatsink t = 1 min a breakdown voltage ( i r =1.0ma, ta =25c ) v br peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode
part no. document number: ds_d1411033 version: e14 description 50 / tube packing (t a =25 o c unless otherwise noted) ratings and characteristics curves preferred part no. part no. example g ito-220ab TSF10U60C taiwan semiconductor ordering information TSF10U60C packing code packing code suffix package c0 TSF10U60C c0g packing code packing code suffix TSF10U60C c0 g green compound 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 t j =25 o c t j =100 o c t j =125 o c t j =150 o c 10 100 1000 10000 0.1 1 10 100 f=1.0mhz v sig =50mv p-p 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 t j =25 o c t j =125 o c t j =150 o c t j =100 o c fig. 2 typical forward characteristics 0 1 2 3 4 5 6 0 25 50 75 100 125 150 with heatsink 4in x 6in x 0.25in al-plate fig.1 forward current derating curve average forward current (a) instantaneous forward current (a) capacitance (pf) instantaneous reverse current (ma) fig. 4 typical junction capacitance fig. 3 typical reverse characteristics case temperature ( o c) forward voltage (v) reverse voltage (v) percent of rated peak reverse voltage (%)
package outline dimensions min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.45 - 0.057 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1411033 version: e14 TSF10U60C taiwan semiconductor marking diagram dim. unit (mm) unit (inch) ito-220ab
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1411033 version: e14 TSF10U60C taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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